Our main service is equipment support for front-end semiconductor manufacturers and equipment makers. We offer preventive maintenance for wire bonder and die attach machines from leading brands to improve yield and productivity.
Our skilled engineers have vast experience handling front-end machinery, including die bonders, automatic gold, copper and aluminium wire bonders, and wafer dicing machines.
Besides maintenance, we also carry out overhaul projects for semiconductor equipment. We overhaul critical machine modules such as bondheads, X-Y stages and workholders, restoring performance to your expectations.
